[1] GENERAL SPECIFICATIONS
1-1Receiving frequency range
1-2Input level[2] MECHANICAL SPECIFICATION 2-1 Dimension
2-2 Strength
2-3 Clamp Torque of F-connector5-8 PLL reference leak 5-9 RF output VSWR 5-10 RF output gain
5-11 Current
consumption(Note): PLL set up rules
The following conditions are required to program the I
According to a required renewal data on each byte, one of the access sequence shown above as a) to h) should be chosen.
1) Write byte1 on the 1
2) Write either byte2 or byte4 on the 2
When the MSB header is 0 on the 2
When the MSB header is 1 on the 2
6-2-2 Data setting
Table 3; Programmable
(Binary: 8 bits)
Dividing
factor (N)
5
6Table 9; Local oscillator select
BAND DIV
1 1 1 1 0
2 1 1 1 1
3 0 0 0 1
4 0 0 1 0Table 13; Baseband AMP gain control (Depend on PLL register setting) BG1 BG0
0 0/1
1 0
1 1[7] CONFIGURATION REGISTERS Table 17; STV0288’s Test Register Value
address [H] data [H] 27.5Msps
00 n/a
01 15
02 20
03 8E[8]TUNER CONTROL PROCEDURE 8-1 FLOW CHART
8-2 VCO and LPF ADJUSTMENT MODE SETTING SEQUENCE AFTER POWER ON and AT EVERY TUNING
I2C Start
Byte1
Set the
[9] Reliability
9-1. High temperature high humidity load (40deg.C, 90% RH, 500h)
1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial
value.
2) After cycling DUT in the constant chamber at 40deg.C/90-95% RH in on state, for total 500h,
leave the DUT at room temperature and humidity for 2h and then measure value after test.
3) Must meet the specifications of Table 19.
4) The contact resistance of F-connector must be less than 0.02 ohm. (*)9-8. Soldering heat resistance
Immerse the terminal mounted on a PCB (1.6t thick) into solder at 350±5deg.C for 3.0-3.5 seconds or at 260 +/-5deg.C for 10 +/-1 seconds. Remove the PCB from the solder and leave it for 1 hour at room temperature. The test sample shall show no degradation in appearance and electrical characteristics.
9-9. ESD protection
Table 18; ESD Test Condition (IEC61000-4-2 Compliant)
RF IN
A RF OUT
B
BS2F7VZ7395 Packaging details
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