• Thick film manufacturing method,ceramic substrate, Silver Alloy fusing element

• -50℃~125℃ operating temperature

• Excellent environmental integrity

• RoHS compliant

• Halogen-free

• LED lighting

• PC related equipment and peripherals (Hard

Driver, Printer, etc.)

• Portable devices (Mobile phone, PDA battery

Charger, etc.)

•Power supply

•Consumer Electronics

• Wireless base station

*Measured at ≤10% rated current and 25℃

** Melting I2T at 10 times of rated current

Agency File Number Ampere Range

JDYX2.E319540 1A

JDYX8.E319540 1A

Certificate File Number

ISO9001:2008 J13Q20625R1M

ISO14001:2004 J13E20626R1M

ISO/TS16949:2009 0181329

Part Number Marking

Current

Rating

(A)

Voltage

Rating

Interrupting

Rating

Max

Cold

DCR*(Ω)

Typical

I2T**

(A2S) S2512-V2-1.0A H 1.0 250V AC

100A@250

V AC

100A@125

V DC

0.300 1.0

General

Application

Agency / Certificate Information

Ordering Information

Catalo

S 2512- V2-1.0A

Shape & Dimensions: (mm)

L(mm) W(mm) T(mm) B(mm) A(mm)

6.40±0.20 3.25±0.20 0.55±0.20 0.85±0.20 0.30±0.20

Components Material

Substrate

Ceramic

Terminations Silver over-plated with nickel and tin (100%) Element

Silver Alloy

Dimensions A(mm) B(mm) C(mm) D(mm)

Spec

4.50±0.50 8.50±0.50 3.50±0.50 2.00±0.50

Catalog Symbol

Dimensions

Recommended Land Patterns

Materials

B

A

D

C

“1.0A” Ampere Rating: 1A

“V2” V = fast acting, 2=250V ac

“2512” Size Number: 2512=6.4mm×3.2mm physical size “S” Symbol of SART

Time Current Curve:

• The current carrying capacity will be affected by ambient temperature which was showed in the figure.

•This current derating curve is for fusing characteristics.

Example,

Work Temp:80℃,

Temp derating factor = 91% I actual = I normal / 0.91

Time Current Curve

Temperature Derating Curve

Ampere Rating % of Current

Rating

Opening Time 1A 100% >4 hours 1A 350%

≤10sec

I 2T vs Time Curve

Electrical Characteristics Temperature in degrees ℃

T e m p d e r a t i n g f a c t o r %

0.0001

0.0010.01

0.1

1

10

1000.1

1

10

100

1000

T i m e (s e c o n d s )

Current (Amperes)

Time Current Curves

0.01

0.1

1

10

100

1000

0.0001

0.01

1

100

I 2T (A 2S )

Time (Seconds)

I 2T vs.Time Curve

Reliability Test:

***

Fuse mounted on board with 1-oz Cu trace

Item

Test condition/ Methods Performance Standard Voltage Drop

100% In; Temperature in fuse was

stabilized

Individual values deviate from mean value:<15% IEC 60127-1

Time/Current

100% In

No Fusing;4hours Min.

Refer to SART

Spec 350% In*** Within 10sec

1000% In***

>10ms

Endurance Test 100% In, 1h on,15min off, 100 cycles;

followed by 1h at 125%In

│△R │<10% Legible appearance

IEC 60127-1 Temperature Rise 100%In │△T │<75℃

UL248-14 Interrupting Ability

100A@250V AC 100A@125V DC

Without permanent arcing, ignition and bursting of

fuse link

UL248-14 Solderability 240℃±5℃,3sec±0.5sec

95% coverage Min. IEC60127-4 IEC60068-2-20 MIL-STD-202 Resistance to Soldering 260℃±5℃,10sec±0.5sec

│△R│<10% Legible appearance

MIL-STD-202 IEC60127-4 Bending Test Distance between holding points ：90mm; Bending ：1mm ; time:10sec

│△R │<10%

No mechanical damages IEC 60127-4 High Temperature Operating Life 70℃±2℃, 96hours, at 60% In

│△R │<10%; no fusing

MIL-STD-202 M1243.ethod

108 Low Temperature Storage

-55℃±2℃, 96hours │△R │<10%

IEC60068-2-1

High Temperature Storage 125℃±2℃, 96hours │△R │<10% IEC60068-2-2 Humidity

(steady state) 40℃±2℃, 90%～95%RH, 1000 hours │△R │<10% MIL-STD-202

Method 103 Salt Spray 5% salt solution ，48hoursexposure │△R│<10% Legible appearance MIL-STD-202 Method 101 Thermal Shock

5 cycles between -55℃/+125℃, 60 minutes ;each extreme

│△R│<10%

No mechanical damages

IEC 60068-2-14

Reliability Test

1. Infrared Reflow: Temperature ：260℃ Time ：5secMax.

Recommend Reflow profile

2.Wave soldering

3.Hand Soldering Reservoir Temperature ：260℃ Temperature ：350℃ Time in Reservoir ：10secMax. Time ：5secMax.

1.Embossed Tape Dimensions

Profile Feature Pb-Free Assembly AverageRamp-Up Rate(Ts max to Tp) 3℃/s Max. Preheat

Temperature Min(Ts min ) Temperature Max(Ts max ) Time(Ts min toTs max )

150℃ 200℃

60sec~120sec Peak Temperature(Tp) 260℃ Time within 5℃ of actual Peak Temperature(Tp) 5sec Melting tin time(T L ) 20sec~30sec Ramp-Down Rate

6℃/s Max. Time 25℃ to Peak Temperature

8 minutes Max.

Type

A(mm)

B(mm)

E(mm)

F(mm)

W(mm)

P0(mm)

P1(mm)

P2(mm)

D0(mm)

T(mm)

2512 3.40±0.10 6.73±0.10 1.75±0.10 5.50±0.10 12.00±0.10 4.00±0.10 4.00±0.10 2.00±0.05 1.50+0.10/-0 0.81±0.10

Recommended Solder Curve

Packaging

Top Tape

Resistor

Embossed Tape

2.Reel Dimensions

Type

A(mm) N(mm) C(mm) D(mm) B(mm) G(mm) T(mm)

2512

178.00±2.00 57.00±0.20 13.00±0.50 21.00±0.50 2.00±0.50 13.00±0.50 15.50±1.50

● The ambient temperature shall between 5℃~30℃.

● The relative humidity recommended for storage is between 25%~60%.

● Sealed plastic bags with desiccant shall be used to reduce the oxidation of the

termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.

Packaging style

Tape and Reel

Type 2512 Quantity(PCS ）

4000

Storage

Number of Package下载本文