AIC6602

Off-Line Linear LED Driver

Analog Integrations Corporation Si-Soft Research Center DS-6602G-P04 20101215

FEATURES

Flexible Voltage Detect.

Wide Range, Programmable LED Voltage. LED Thermal Regulation.

Fixed Current Operation: 20mA, 25mA, 30mA Can be Paralleled for Higher Current 50V to 500V Supply Voltage Range. Low Quiescent Current. High Efficiency. LED Brightness Stable. No Need External Component. User TRIAC Dimming Control.

SOP-8 Exposed pad (Heat Sink) Package.

Patent Pending Drive Architecture.

APPLICATIONS

LED Lamps (e.g. E27, GU10) General Illumination LED Strings (e.g. T-8 Tube) Constant Current Source

Constant Current Sink

DESCRIPTION The AIC6602 is off-line linear LED driver. The application of high bright LED is widely used for general illumination.

The AIC6602 can drive a plurality of LED strings. When the voltage detecting circuit detects the different voltage level of input voltage, it can control the LED strings. If the input voltage is lower that it will bypass some LED strings. And turn on all LED strings when the input voltage is higher. The number of LEDs in LED array is dependent on the voltage level of the AC power source, that includes of ±15% variations. A typical application for the AIC6602 is to drive LEDs with a constant current of 20mA, 25mA, 30mA and 35mA. Multiple AIC6602 can also be used in parallel to provide higher currents.

The quality of fixed current and wide range voltage makes this device ideal for TRIAC dimming applications.

The AIC6602 is available in a SOP-8 Exposed Pad (Heat Sink) package.

TYPICAL APPLICATION CIRCUIT

S2 LED String

ORDERING INFORMATION

PIN CONFIGURATION

PACKAGE TYPE R8 (SOP-8)

R8: SOP-8 Exposed Pad (Heat Sink) Example: AIC6602-20GR8TR

20mA Version, in SOP-8 Expose Pad(Heat Sink)

Green Package and TAPE & REEL Packing Type.

20:20mA

25:25mA 30:30mA

8

6 5

7 1 3 2

4

GND

SOP-8 Exposed Pad (Heat Sink) TOP VIEW

1: ST 2: GND 3: S1 4: S2 5: S3 6: NC 7: VIN 8: NC

ABSOLUTE MAXIMUM RATINGS

VIN Pin Voltage .............................................................................................................................550V S1, S2 & S3 Pin Voltage................................................................................................................350V Operating Ambient Temperature Range T A........................................................................-40ºC~85ºC Operating Maximum Junction Temperature T J............................................................................150ºC Storage Temperature Range T STG....................................................................................-65ºC~150ºC Lead Temperature (Soldering 10 Sec.)........................................................................................260ºC Thermal Resistance Junction to Case SOP-8 Exposed Pad*...........................................15ºC /W Thermal Resistance Junction to Ambient SOP-8 Exposed Pad*…........................................60ºC /W (Assume no Ambient Airflow, no Heatsink)

Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.

*The package is place on a two layers PCB with 2 ounces copper and 2 square inch, connected by 8 vias.

ELECTRICAL CHARACTERISTICS

(T J=25°C, unless otherwise specified) (Note 1)

PARAMETER TEST CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply Voltage Section

VIN Operation Voltage 50 500 V

Quiescent Current VIN=310V I VIN300 µA

LED Current

LED Current Tolerance I s3-10 +10 %

Mismatch Ratio among

-10 +10 % channels

Fault Protection

Thermal Regulation 140 ℃

Note 1: Specifications are production tested at T A=25°C. Specifications over the -40°C to 85°C operating temperature range are assured by design, characterization and correlation with Statistical Quality

Controls (SQC).

TYPICAL PERFORMANCE CHARACTERISTICS

Fig. 1 Input Power vs. Temperature

Fig. 2 LED Current Waveform at 220 V AC Input

BLOCK DIAGRAM

PIN DESCRIPTION

ST PIN

-Provide the Startup Current for the Controller.

VIN PIN - Power Supply Input.

S1PIN -LED S1 Cathode Connection. S2PIN -LED S2 Cathode Connection. S3 PIN -LED S3 Cathode Connection. GND PIN -Ground.

Rectified Input Voltage

LED Current

Input Voltage = 220 V AC

AIC6602

APPLICATION INFORMATION

The AIC6602 is off-line constant current LED driver. It can drive a plurality of LED strings. The AIC6602 can flexibly control the LED strings according to the variance of input voltage. If the input voltage is lower, it will bypass some LED strings. When the input voltage is higher than the total forward voltage of all LED strings, all LED strings will be turned on. The number of LEDs in LED array is dependent on the voltage level of the AC power source. Multiple AIC6602 can also be used in parallel to provide higher LED current.

THERMAL REGULATION

The AIC6602 includes the thermal-regulation circuit, which are designed to protect the device from excessive temperature. The internal thermal-regulation circuit reduces the LED current if the junction temperature rises above the preset value of about 140ºC.

POWER DISSIPATION

The maximum power dissipation of AIC6602 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly

affected

by

the

mounting

pad

configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies.

As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature.

APPLICATION CIRCUIT

Fig. 3 AIC6602 for Higher LED Current Application

AIC6602

7

PHYSICAL DIMENSIONS

SOP-8 Exposed Pad (Heat Sink)

Note:

Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice.

Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. A

θ

L

VIEW B

.25SEATING PLANE

SECTION A-A

BASE METAL

GAUGE PLANE WITH PLATING

A

1B

C

Note : 1. Re fe r to JEDEC MS -012E.

2. Dime ns ion "D" doe s not include mold fla s h, protrusions or ga te burrs. Mold fla s h, protrusion or ga te burrs s ha ll not e xce e d 6 mil pe r s ide .

3. Dime ns ion "E" doe s not include inte r-le a d fla sh or protrusions.

4. Controlling dime ns ion is millime te r, conve rte d inch dime ns ions a re not ne ce s sa rily e xa ct.

h q

L D e H E

C B A10.500.250.400°

1.278°1.27 BSC

4.80

5.803.80

0.310.170.00 5.006.204.00

0.510.250.15S Y M B O L

A SOP -8 Exposed Pad(Heat Sink)MILLIMETERS 1.35MIN. 1.75MAX.D1E1

1.51.0

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