Noninverting Buffer /
CMOS Logic Level Shifter
with TTL-Compatible Inputs
The MC74VHC1GT50 is a single gate noninverting buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output.
The device input is compatible with TTL-type input thresholds and the output has a full 5 V CMOS level output swing. The input protection circuitry on this device allows overvoltage tolerance on the input,allowing the device to be used as a logic-level translator from 3.0 V CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the high-voltage power supply.
The MC74VHC1GT50 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the MC74VHC1GT50 to be used to interface high voltage to low voltage circuits. The output structures also provide protection when V CC = 0 V . These input and output structures help prevent device destruction caused by supply voltage - input/output voltage mismatch,battery backup, hot insertion, etc.
•Designed for 1.65 V to 5.5 V CC Operation
•High Speed: t PD = 3.5 ns (Typ) at V CC = 5 V
•Low Power Dissipation: I CC = 1 m A (Max) at T A = 25°C •TTL-Compatible Inputs: V IL = 0.8 V; V IH = 2.0 V , V CC = 5 V •CMOS-Compatible Outputs: V OH > 0.8 V CC ; V OL < 0.1 V CC @Load •Power Down Protection Provided on Inputs and Outputs •Balanced Propagation Delays
•Pin and Function Compatible with Other Standard Logic Families •
Chip Complexity: FETs = 104; Equivalent Gates = 26
Figure 1. Pinout (Top View)
IN A
OUT Y
1
V CC
NC
IN A OUT Y
GND Figure 2. Logic Symbol
PIN ASSIGNMENT
123GND NC IN A 45
V CC
OUT Y See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
FUNCTION TABLE
L H
A Input
Y Output
L H
SC-88A / SOT-353/SC-70
DF SUFFIX CASE 419A
Pin 1
d = Dat
e Code
VL d
TSOP-5/SOT-23/SC-59
DT SUFFIX CASE 483
Pin 1
d = Dat
e Code
VL d
MARKING
DIAGRAMS
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MAXIMUM RATINGS (Note 1)
indicated may adversely affect device reliability. Functional operation under absolute-maximum-rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions.2.Tested to EIA/JESD22-A114-A 3.Tested to EIA/JESD22-A115-A 4.Tested to JESD22-C101-A 5.Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Device Junction Temperature versus Time to 0.1% Bond Failures
11
10
100
1000
TIME, YEARS
N O R M A L I Z E D F A I L U R E R A T E
Figure 3. Failure Rate vs. Time Junction Temperature
PD Average operating current can be obtained by the equation: I CC(OPR ) = C PD V CC f in + I CC . C PD is used to determine the no-load dynamic power consumption; P D = C PD V CC 2 f in + I CC V CC .
GND
A
Y
*Includes all probe and jig capacitance
C L *
Figure 4. Switching Waveforms Figure 5. Test Circuit
V OH V OL
V CC
DIRECTION OF FEED
Figure 6. Tape Ends for Finished Goods
“T1” Pin One Toward Sprocket Hole (3k Reel)
“T2” Pin One Opposing Sprocket Hole (3k Reel)
Figure 7. SC-88A/SOT-353/SC-70-5 DFT1 and DFT2
Reel Configuration/Orientation
“T1” Pin One Opposing Sprocket Hole (3k Reel)
Figure 8. TSOP-5/SC59-5/SOT23-5 DTT1
Reel Configuration/Orientation
Figure 9. Reel Dimensions
REEL DIMENSIONS
Tape Size 8 mm
T and R Suffix
T1, T2
A Max 178 mm (7 in)
G
8.4 mm, + 1.5 mm, -0.0(0.33 in + 0.059 in, -0.00)
t Max 14.4 mm (0.56 in)
Figure 10. Reel Winding Direction
HOLE
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7
SC-88A / SOT-353 / SC-70
DF SUFFIX 5-LEAD PACKAGE
NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 198
2.
2.CONTROLLING DIMENSION: INCH.
3.419A−01 OBSOLETE. NEW STANDARD 419A−02.
DIM
A MIN MAX MIN MAX MILLIMETERS
1.80
2.200.0710.087INCHES B 1.15 1.350.0450.053C 0.80 1.100.0310.043D 0.100.300.0040.012G 0.65 BSC 0.026 BSC H −−−0.10
−−−0.004J 0.100.250.0040.010K 0.100.300.0040.012N 0.20 REF 0.008 REF S
2.00 2.20
0.0790.087
TSOP-5 / SOT-23 / SC-59
DT SUFFIX 5-LEAD PACKAGE NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 198
2.
2.CONTROLLING DIMENSION: MILLIMETER.
3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
DIM MIN MAX MIN MAX INCHES
MILLIMETERS A 2.90 3.100.11420.1220B 1.30 1.700.05120.0669C 0.90 1.100.03540.0433D 0.250.500.00980.0197G 0.85 1.050.03350.0413H 0.0130.1000.00050.0040J 0.100.260.00400.0102K 0.200.600.00790.0236L 1.25 1.550.04930.0610M 0 10 0 10 S
2.50
3.00
0.09850.1181
____ǒmm inches
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PUBLICATION ORDERING INFORMATION
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