●DEVICE NUMBER ：BL-HG632X-TRB

佰鴻工業股份有限公司

台北縣板橋市和平路19號3樓

Taipei, Taiwan, R. O. C. Tel: 886-2-29591090

Fax: 886-2-29547006/29558809 www.brtled.com .

佰鴻工業股份有限公司 http://www.brtled.com

● Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating

Unit

Power Dissipation Pd 120 mW

Forward Current

I F 30 mA

Peak Forward Current*1 I FP 100 mA

Reverse Voltage V R 5 V

Operating Temperature Topr -40℃~100℃ - Storage Temperature Tstg -40℃~100℃ - Soldering Temperature

Tsol

See Page 6

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*1 Condition for I FP is pulse of 1/10 duty and 3 msec width.

● Typical Electro-Optical Characteristics Curves

R e l a t i v e l u m i n o u s i n t e n s i t y (@20m A )

Forward current (mA)

F o r w a r d c u r r e n t (m A )

Fig.1 Relative intensity vs. wavelength

R e l a t i v e r a d i a n t i n t e n s i t y

vs. ambient temperature Fig.2 Forward current derating curve 0

●Package Method:(unit: mm)

12 bag/box

佰鴻工業股份有限公司 Tolerance for each Bin limit is ±10%.

● Color Bin Limits (At 20 mA) Tolerance for each Bin limit is ± 1 nm. ● Forward Voltage Bin Limits (At 20 mA) BIN CODE Min.(V) Max.(V)

G 2.8 3.0 H 3.0 3.2 J 3.2 3.4 K 3.4 3.6 Tolerance for each Bin limit is ± 0.02V.

● BIN ：x x x V F B I N C O D E

C o l o r B I N C O

D E

I n t e n s i t y B I N C O D E

BIN CODE Min. (nm) Max. (nm)

6 520 525

7 525 530

佰鴻工業股份有限公司 http://www.brtled.com

● Judgment criteria of failure for the reliability

Measuring items Symbol Measuring conditions Judgment criteria for failure

Forward voltage V F (V) I F 20mA Over U 1x1.2

Reverse current I R (uA) V R 5V Over U 1x2 Luminous intensity

Iv ( mcd ) I F 20mA Below S 1X0.5

Note: 1. U means the upper limit of specified characteristics. S means initial value.

2. After each test, remove test pieces, wait for 2 hours and test pieces have returned to ambient

temperature, then take next measurement.

佰鴻工業股份有限公司 http://www.brtled.com

within 3 seconds per solder-pad. 2. Reflow Soldering

Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 260℃(Max.) within 10 seconds.(Max) 3. Preheating : 120℃~150℃,within 120~180 sec.

Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). ● Handling :

Care must be taken not to damage LED’s epoxy resin while exposing to high temperature or contact LED’s epoxy resin with hard or sharp objects, such as metal hook, tweezer or sand blasting .

Time

佰鴻工業股份有限公司

instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage:

In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope.

If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions:

12 hours at 60℃±3℃. ● Package and Label of Products:

(1) Package: Products are packed in one bag of 2000 pcs (one taping reel) and a label is attached on each bag.

(2) Label: BRIGHT LED LOGO Part No. Quantity BIN.

Sealing Date xx xx xx Year Month Day Location

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